Hua Hong Grace Semiconductor, China’s second-largest contract chipmaker, plans a major expansion into silicon photonics used in AI optical modules during its next capacity build-out in 2027, the South China Morning Post reports. Chairman and president Bai Peng told analysts the firm wants a role in all silicon-based devices inside those modules, alongside more power-management chip output.
The push comes as Hua Hong reported net profits up 147%, according to the paper, and seeks a larger share of AI infrastructure demand. Silicon photonics moves data with light on chips and is seen as key to faster, more efficient AI networking. Further factory and investment figures were limited in the initial earnings-call coverage.
Source: South China Morning Post